In HPC, we expect the increasing workload in data center and complexity of AI will boost the demand for AI accelerator, GPU and CPU in server. We also expect the introduction of next-generation video gaming will add growth of HPC. We believe all our 4 core platforms -- smartphone, HPC, IoT and automotive -- are well positioned to benefit from the longer-term mega trend of AI and 5G. With our leading and comprehensive technology offering our vast capacity and our policy of not competing with customers, we will be able to support our customers to expand their markets and, therefore, fuel our future growth.
Let me talk about N7 ramp-up status. TSMC's 7-nanometer technology is leading in the industry. It has the best performance, power and area density, and its schedule is ahead of competition. For the tape-outs that we have completed for customers, all have very good yield and performance. We forecast a total of more than 50 customer product tape-outs by end of this year from a wide range of applications covering mobile, server CPU, network processor, gaming, GPU, FPGA, cryptocurrency, automotive and AI. Our 7-nanometer is already in volume production and accounted for less than 1 percent of our total wafer revenue in second quarter. It's expected to jump to more than 10% of our wafer revenue in third quarter and is estimated to contribute more than 20% revenue for us in fourth quarter this year.
Let me talk about the N7+ and EUV. Our 7-nanometer-plus or N7+ can leverage the success of our N7 and enjoy 15% to 20% better gate density and more than 10% power reduction. With a few EUV layers replacing certain immersion lithography process, we are able to have fewer masking layers, shorter cycle time and less process complexity. Therefore, we expect to achieve better yield as compared to our N7.